Effect of Cu content on structural properties of Ni-Cu @ a-C: H thin films |
کد مقاله : 1126-PHYCHEM23 |
نویسندگان |
سمیرا گودرزی * گروه فیزیک، دانشکده ملایر، دانشگاه ملایر، ملایر، ایران |
چکیده مقاله |
In this study, Ni-Cu NPs @ a-C:H films with different Cu percentages, by co-deposition of RF-sputtering and RF-plasma enhanced chemical vapor deposition (RF-PECVD) were prepared using acetylene gas and Ni and Cu targets. The EDAX results show that the Ni and Cu are presented in the films successfully. With the increase of Cu percentages, the average diameter of CNTs was increased. |
کلیدواژه ها |
Ni-Cu thin films, RF-PECVD system, Scanning Electron Microscope (SEM) |
وضعیت: پذیرفته شده برای ارائه شفاهی |